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The main application is to replace thermal conductive silicone (cream) for CPU and radiator, thyristor module and intelligent control radiator, high-power electric filling adhesive between the module and the radiator. After using this glue, can get rid of the traditional CARDS and screw connection way, the result is more reliable to fill the cooling, simpler process and more economic cost.

Feature:

• K-5202 is a reinforced thermally conductive silicone elastomer with great adhesion, insulation and dissipation.
• One part, room cure, packing in soft metal tube.
• Excellent in cold and high alternating resistance (-60°c~ 280°c).
• No peeling and good disassemble after long time usage.
• The elastomer with high bonding strength , the shear strength is 30kg/cm3.

Typical Properties: 

• Property Name: K-5202
• Appearance: White
• Viscosity (cp): Thixotropic elastomer
• Density(g/cm3): 2.0~3.0
• Initial Curing Time(25c, min): <=10
• Cured Mechanical Properties Tensile Strength (Mpa): >=2.5
• Elongation At Break (%): >=100
• Shear Strength (Mpa): >=1.5
• Hardness(shore A): 50~65
• Working Temp ( c): -60~280
• Electrical Properties Dielectric Strength(kv/mm): >=18
• Permittivity (@60Hz): 2.8
• Volume Resistivity (?.cm): 1×1015
• Coefficient of Thermal Conductivity(w/m.k): 1.6

Curing Condition:

• The curing progress is from outer surface into inner surface.
• The elastomer get cure with the depth of 2~4mm in 24 hours (at room temperature, 55% moisture). if the bonded
• parts is too deep (especially the parts not easy to contact with air) or the temperature is too low, the full curing time will be extend.
• Advise user preparing enough time to let elastomer get full cure in order to keep the properties stably.

HOW TO USE:

• Clean the un-bonded or uncoated surfaces by removing the rust, ash, and oil, etc.

Application:

• Pierce the opening with the tip of the cap. Fix the nozzle, and coat the clean surface evenly with the adhesives, then bond the two surfaces.
• fill, bond, and seal in electronics,
• The gap between CPU and radiators,
• The gap between thyristor control modules and radiator,
• The filling of high-power electronics modules and radiators, etc.

Packing:

• 80g Kafuter K-5202

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